Alignment and orientation features for a semiconductor package

ABSTRACT

A semiconductor device formed by an automated wire bonding system. The semiconductor device comprises a lead frame having a plurality of lead fingers and a die paddle, and a semiconductor die mounted to the die paddle. The die paddle comprises a plurality of eyepoint features that extend from the die. The die comprises a first plurality of bonding pads and the lead fingers comprise a second plurality of bonding pads. The first and second bonding pads are interconnected by a plurality of connecting wires which are installed by the automated wire bonding system. The wire bonding system obtains an image of the lead frame and identifies the eyepoint features of the die paddle within the image so as to more accurately determine the positions of the second wire bonding pads of the lead frame with respect to the wire bonding system.

RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.09/489,998, filed Jan. 21, 2000 now U.S. Pat. No. 6,577,019, which ishereby incorporated in its entirety by reference herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to semiconductor devices and, inparticular, relates to a semiconductor device comprising a semiconductordie having a first plurality of bonding pads, and a lead frame having asecond plurality of bonding pads, wherein the first bonding pads areconnected to the second bonding pads by an automated wire bondingsystem.

2. Description of the Related Art

Advances in semiconductor processing methods continually provide modularsemiconductor devices with increased circuit density and, thus,increased functionality. As a result, such devices are formed withreduced packaging sizes having increased numbers of conducting pathsextending therefrom. Consequently, the problems associated withproviding electrical connection to such devices are becomingincreasingly apparent as will now be described in greater detail.

The typical semiconductor device comprises an extremely smallsemiconductor die encapsulated within a protective packaging material.In particular, the semiconductor die comprises electronic circuitryformed in a high density configuration. Such semiconductor dice includea plurality of circuit elements, such as transistors, diodes, resistorsand capacitors, having sub-micron level dimensions. Furthermore, thecircuit elements are electrically interconnected within the die in apreferred manner so as to provide the semiconductor die with a desiredset of performance characteristics.

The typical semiconductor die is usually provided with a first pluralityof wire bonding surfaces, otherwise referred to hereinbelow as bondingpads. In particular, the bonding pads are adapted to bond with firstends of a plurality of interconnecting conducting wires so that thefirst ends of the conducting wires are mechanically and electricallycoupled to the first bonding pads. Additionally, the first bonding padsare arranged in a high density configuration on a surface of the diesuch that the pads are electrically coupled to specific circuit nodeswithin the die.

The typical semiconductor device further comprises a lead frame thatprovides the device with exposed leads that extend outside of thepackaging material and that electrically couple with the circuit nodesof the encapsulated die. In particular, the lead frame usually includesa die mounting platform, otherwise known as a die paddle, which isadapted to fixedly support the die with respect to the lead frame. Thelead frame of the typical semiconductor device further comprises aplurality of lead fingers which are disposed in a generally radialpattern around the die paddle so that the die mounted on the die paddleand the lead fingers are initially disposed in a generally common plane.Moreover, the lead fingers outwardly extend from first ends positionedat the interior of the packaging material adjacent the die paddle tosecond ends positioned at the exterior of the packaging material.Furthermore, a second plurality of bonding pads akin to the firstbonding pads are usually located at the first ends of the lead fingers.Moreover, as will be described in greater detail below, the conductingwires are attached between the first and second bonding pads in a wirebonding process so as to electrically couple the first pads with thesecond pads.

Following the wire bonding process, the die is encapsulated within thepackaging material which is typically formed with a rectangular shape.Furthermore, in addition to encapsulating the die, the packagingmaterial also encapsulates the die paddle and the first ends of the leadfingers of the lead frame. However, the second ends of the lead fingersare positioned outside of the packaging material so that they are theexposed leads of the semiconductor device. Moreover, the exposed leadsare typically bent so that each lead is positioned adjacent an exteriorsurface of the packaging material in a flush manner and so that theleads do not contact each other. Thus, since the conducting wireselectrically couple the first and second bonding pads, the exposed leadsare electrically coupled with the circuit nodes of the die.

Usually, each of the interconnecting conducting wires extending betweenthe lead frame and the die are sequentially installed by an automatedwire bonding system prior to encapsulation of the die. In particular,the typical wire bonding system is adapted to position the first end ofa particular conducting wires adjacent the corresponding first bondingpad of the die in a flush manner. The wire bonding system is alsoadapted to bond the first end of the conducting wire to thecorresponding first bonding pad so that the first end is fixedlyattached thereto. Furthermore, the wire bonding system is adapted toposition the second end of the conducting wires adjacent thecorresponding second bonding pad of the lead frame in a flush manner andsubsequently bond the second end thereto.

To determine the relative positions of the first and second bonding padswith respect to the wire bonding system, the typical automated wirebonding system utilizes an imaging device to obtain a digitized image ofthe lead frame having the die mounted thereto. In particular, the imageis scanned by a processor which attempts to identify particular featuresof the die and lead frame. More particularly, the relative positions ofthe first bonding pads are determined by locating the die within theimage. Furthermore, the positions of the second bonding pads of the leadframe are usually determined by identifying and locating the first endof at least one of the lead fingers of the lead frame within the imageas disclosed in U.S. Pat. No. 5,350,106 to Fogal. Moreover, since thefirst ends of the lead fingers are fixedly positioned with respect toeach other in a predefined manner, the positions of the remaining secondbonding pads are determined by referencing the position of the first endof the at least one identified lead finger.

However, with the advent of increased circuit density, lead frames arerequired to accommodate greater numbers of lead fingers in higherdensity configurations. In particular, the increased density of the leadfingers requires their first ends and, thus, the second bonding padsformed thereon to be formed with reduced dimensions. Consequently, sinceit is generally not practical to provide relatively small bonding padswith a distinctive shape, the first ends of the lead fingers are oftenformed with nearly identical geometries. Thus, it is becomingincreasingly difficult to correctly distinguish the first ends of thelead fingers of the lead frame from each other. As a result, automatedwire bonding systems are increasingly having difficulties in identifyingthe lead fingers to connect the appropriate wirebonds.

For example, while attempting to identify the first end of the firstlead finger of a high density lead frame, it is possible that thetypical wire bonding system could mistakenly identify the first end of aneighboring second lead finger having a geometry similar to that of thefirst lead finger. Thus, the position of the first end of the first leadfinger will be incorrectly determined. Furthermore, since the wirebonding system uses the position of the first end of the first leadfinger to determine the positions of the first ends of the remaininglead fingers, the wire bonding system will incorrectly determine thepositions of the first ends of the remaining lead fingers. Consequently,since the wire bonding system is unable to properly connect the firstand second bonding pads together, the semiconductor device will notprovide the desired electrical characteristics.

Another shortcoming of prior art wire bonding systems is that theyutilize lead frames that provide an insufficient indication of theorientation of the lead frame. In particular, it is possible for thelead frame to be mistakenly oriented within the wire bonding system in arotated manner such that the lead frame is rotated by 180 degrees aboutan axis that extends perpendicularly from the plane of the lead frame.Since the lead frame is often formed in a symmetrical manner withrespect to such a rotation, this problem may be overlooked by anobserver responsible for visually inspecting the orientation of the leadframe. Moreover, since the typical lead frame comprises a symmetricalshape with respect to the 180 degree rotation, the wire bonding systemmay not identify the incorrect orientation of the lead frame.Consequently, since the first bonding pads are often disposed on the diein an asymmetrical manner and since the interconnecting wires are ofteninstalled with an asymmetrical configuration, it is likely thatconsiderable time and materials will be wasted by the wire bondingsystem in a futile attempt to electrically couple the die with the leadframe. Thus, since semiconductor devices formed in this manner lack theappropriate conducting paths that extend from the exposed leads, thisproblem results in increased failure rates, reduced production yieldsand increased production costs.

From the foregoing, therefore, it will be appreciated that there is aneed for an improved automated wire bonding system. In particular, thereis a need for the improved system to more reliably provide a highdensity semiconductor device with correctly extending conducting pathsbetween exposed leads of a lead frame of the device to appropriatecircuit nodes within an encapsulated semiconductor die of the device.Furthermore, there is a need for the system to utilize a lead frame thatallows a user to more easily identify whether the lead frame iscorrectly oriented within the wire bonding system.

SUMMARY OF THE INVENTION

The aforementioned needs are satisfied by the present invention which,according to one aspect, comprises a semiconductor device that includesa semiconductor device having a first plurality of bonding pads disposedalong a surface of the die. The semiconductor device further comprises alead frame that includes a die paddle for supporting the semiconductordie, and a plurality of lead fingers having a second plurality ofbonding pads formed thereon. The die paddle comprises a mounting regionand at least one eyepoint feature that extends from the mounting region.The semiconductor die is mounted adjacent the mounting region of the diepaddle so that the die is secured to the die paddle and so that the diedoes not extend over the at least one eyepoint feature. Thesemiconductor device further comprises a plurality of connecting wiresthat extend between the first and second bonding pads so as to provideelectrically conducting paths therebetween.

In another aspect of the present invention, a method of electricallyconnecting a first plurality of bonding pads of a semiconductor die to asecond plurality of bonding pads located on lead fingers of a lead frameof a semiconductor device comprises obtaining an image of the leadframe. The method further comprises identifying the location of aneyepoint feature formed on a die paddle of the lead frame adapted toreceive the semiconductor die. The method further comprises determiningthe relative location of the second plurality of bonding pads from theidentified location of the eyepoint feature located on the die paddle ofthe lead frame.

In a further aspect of the present invention, a wire bonding system isprovided for wire bonding between a first plurality of bonding padslocated on a surface of a die positioned on a die paddle of a lead frameand a second plurality of bonding pads located on lead fingers of a leadframe wherein the lead frame further comprises at least one eyepointfeature located on the die paddle. The system comprises an imagingdevice that obtains an image of the lead frame and a processor thatreceives the obtained image and evaluates the received image todetermine the location of the at least one eyepoint feature located onthe die paddle of the lead frame. The processor further determines therelative location of the second plurality of bonding pads from thedetermined location of the at least one eyepoint features. The systemfurther comprises a wire bonding device that receives signals from theprocessor that attaches wire bonds between the first plurality ofbonding pads and the second plurality of bonding pads as located by theprocessor from the image obtained by the imaging device.

In yet another aspect of the present invention, a lead frame comprises adie paddle having a plurality of outer lateral edges wherein the diepaddle is adapted to receive a semiconductor die having a firstplurality of bonding locations. The lead frame further comprises aplurality of lead fingers defining second bonding locations to whichwire bonds are to be bonded in a desired pattern between the firstplurality of bonding locations and a second plurality of bondinglocations. The lead frame further comprises at least one eyepointfeature formed on a lateral edge of the die paddle so as to be visiblewhen the die is mounted on the die paddle. The at least one eyepointfeature is fixedly positioned with respect to the second bondinglocations so that the at least one eyepoint provides a point ofreference from which the relative location of each of the second bondinglocations with respect to an origin can be determined.

In another aspect of the present invention, a lead frame comprises a diepaddle having a plurality of outer lateral edges wherein the die paddleis adapted to receive a semiconductor die. The lead frame furthercomprises a plurality of lead fingers and an orientation indicatorformed on a lateral edge of the die paddle so as to be visible when thedie is mounted on the die paddle. The orientation indicator extends in adirection corresponding to the orientation of the lead frame and enablesa human observer to visually determine the orientation of the lead frameby observing the direction of extension of the orientation indicator.

From the foregoing, it should be apparent that the eyepoint featuresextending from the die paddle of the lead frame of the preferredembodiments of the present invention enable the second bonding pads ofthe lead frame to be determined with greater accuracy. This enables thesemiconductor die to be wire-bonded to the lead frame with greaterreliability. These and other objects and advantages of the presentinvention will become more apparent from the following description takenin conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an perspective view of a semiconductor device in accordancewith one aspect of the present invention;

FIG. 2 is an overhead view of one embodiment of a lead frame of thesemiconductor device of FIG. 1 illustrating a plurality of lead fingersand a die paddle of the lead frame;

FIG. 3 is a magnified view of the lead frame of FIG. 2 that illustratesthe die paddle and a plurality of wire bond pads of the lead fingers ingreater detail;

FIG. 4 is a magnified view of the lead frame of FIG. 2 that illustratesa semiconductor die mounted to the die paddle and a plurality of wirebonds formed between a plurality of wire bond pads of the semiconductordie and the wire bond pads of lead fingers;

FIG. 5 is a schematic diagram of a wire bonding system in accordancewith one aspect of the present invention which is adapted to provide thewire bonded lead frame of FIG. 4; and

FIG. 6 is a flow chart that illustrates the operation of a controller ofthe wire bonding system of FIG. 5.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Reference will now be made to the drawings wherein like numerals referto like parts throughout. In particular, FIG. 1 illustrates asemiconductor device 30 in accordance with one aspect of the presentinvention. The semiconductor device 30 comprises a known semiconductordie 32 housed within a known packaging material 34. The semiconductordie 32 comprises a preferred configuration of circuit elements that areinterconnected so as to provide an electrical integrated circuit of anyof a number of possible configurations. The semiconductor die 32 furthercomprises a first plurality of bonding pads 36 disposed a first surface38 of the die 32 that electrically couple with a plurality of circuitnodes of the electrical circuit of the die 32.

As shown in FIG. 1, the semiconductor device 30 further comprises aplurality of exposed leads 40 that extend into the packaging material 34so as to provide conducting paths that extend from the leads 40 towardthe encapsulated die 32. As will be described in greater detail below inconnection with FIG. 2, the semiconductor device 30 further comprises alead frame 42 that includes a plurality of lead fingers 44 extendingfrom the exposed leads 40 to an interior region of the packagingmaterial 34. Furthermore, as will be described in greater detail belowin connection with FIGS. 3 through 6, the lead frame 42 is adapted sothat an improved automated wire bonding system 110 can be utilized tomore reliably wire bond the die 32 to the lead frame 42.

Reference will now be made to FIG. 2 which illustrates the initiallyconfigured lead frame 42 of the semiconductor device 30 in accordancewith one aspect of the invention. In particular, the lead frame 42 isinitially formed with a generally planar shape of conducting material,such as copper, that is held together by supporting border elements 46that are formed around the perimeter of the lead frame 42. Furthermore,the lead frame 42 comprises a generally planar die paddle 50 positionedat the center of the lead frame 42 and supported by the supportingborder elements 46 by a plurality of die paddle support elements 52 thatoutwardly extend from the die paddle 50 to the supporting borderelements 46. The purpose of the die paddle 50 is to support thesemiconductor die 32 so that the die 32 is positioned substantially atthe center of the lead fingers 44. Moreover, as will be described ingreater detail below in connection with FIGS. 3 through 6, the diepaddle 50 includes at least one distinctive feature 54, otherwisereferred to as an eyepoint feature 54, that enables the wire bondingsystem 110 to form wire bonds with greater reliability.

As shown in FIG. 2, the lead frame further comprises the plurality oflead fingers 44. In particular, each lead finger 44 includes a first end56 that is positioned adjacent to and separately from the die paddle 50.As will be described in greater detail below in connection with FIG. 4,the first end 56 of each lead finger is wire bonded to a correspondingfirst bonding pad 36 (FIG. 1) on the die 32 in a known manner so as toelectrically couple the first ends of the lead fingers with the firstbonding pads.

As shown in FIG. 2, each lead finger 44 outwardly extends from the firstend 56 toward a second end 58. In particular, in the initialconfiguration of the lead frame 42, the second ends 58 of the leadfingers 44 are connected to the supporting border elements 46 so thatthe lead fingers 44 are fixedly positioned with respect to the diepaddle 50 during fabrication of the semiconductor device 30 and so thatthe second ends 58 are distally positioned with respect to the diepaddle 50. However, in a final configuration, the second ends 58 of thelead fingers 44 are located outside of the packaging material 34 andsevered from the supporting border elements in a manner known in the artso that the lead fingers 44 are electrically isolated from each other.Furthermore, in one embodiment, the exposed second ends 58 of the leadfingers 44 are bent to become the exposed leads 44 of the semiconductordevice 30 as shown in FIG. 1.

Reference will now be made to FIG. 3 which illustrates one embodiment ofthe die paddle 50 of the lead frame 42 in greater detail. In particular,the die paddle 50 comprises a substantially rectangular die mountingregion that includes first and second longitudinal side edges 62, 64,and first and second lateral side edges 66, 68 that join to form first,second, third, and fourth corners 70, 72, 74 and 76. More particularly,the die mounting region 60 provides a mounting surface 78 that isadapted to support the semiconductor die 32. The die paddle 50 furthercomprises the eyepoint features 54 that extends from the rectangularmounting region 60.

As shown in FIG. 3, in one embodiment, the eyepoint features 54 comprisefirst, second, third, and fourth eyepoint features 54 a-54 d that extendfrom the die mounting region 60 adjacent the corners 70, 72, 74 and 76of the die paddle 50 respectively. The eyepoint features 54 a and 54 brespectively extend from the lateral edge 66 of the die mounting region60 adjacent the corners 70, 72. Furthermore, the eyepoint features 54 cand 54 d respectively extend from the lateral edge 68 of the diemounting region 60 adjacent the corners 74 and 76.

As shown in FIG. 3, the eyepoint features 54 are formed with arelatively large distinctive shape. In particular, in one embodiment,each eyepoint feature 54 includes a first edge 80 that perpendicularlyextends from the lateral edges 66, 68 of the die mounting region 60 ofthe die paddle 50. Furthermore, each eyepoint feature 54 includes asecond edge 82 that initially extends from the first edge in aperpendicular manner so as to provide each eyepoint feature 54 with arelatively sharp point 84. Moreover, each eyepoint feature 54 includes athird edge 86 that initially extends from the lateral edges 66, 68 ofthe rectangular region 60 in a perpendicular manner toward the secondedge 82 in a gradual manner so as to form a curved region 88.Additionally, the eyepoint feature 54 are formed with a width extendingfrom the first edge 80 to the third edge 86 which is substantiallylarger than the width of the first ends 56 the lead fingers 44 of thelead frame 42. Thus, as will be described in greater detail below inconnection with FIGS. 4 and 5, the advantageous shape of the eyepointfeatures 54 enables their locations to be reliably determined by theautomated wire bonding system 110.

As shown in FIG. 3, the eyepoint features 54 as a group are preferablyarranged in an asymmetrical manner such that the eyepoint features 54are substantially separated from each other. In particular, the eyepointfeatures 54 a and 54 b extending from the lateral edge 66 of the diemounting region 60 are arranged so that their curved regions 88 areproximally positioned with respect to each other and so that their sharppoints 84 are distally positioned with respect to each other.Furthermore, the eyepoint features 54 c and 54 d extending from thelateral edge 68 are arranged so that their sharp points 84 areproximally positioned with respect to each other and so that theircurved regions 88 are distally positioned with respect to each other.

As shown in FIG. 3, in one embodiment, the die paddle 50 furthercomprises an eyepoint feature 90 that enables an observer to quicklydetermine the orientation of the lead frame 42. In particular, theeyepoint feature 90 outwardly extends from the center of the lateraledge 66 of the die paddle 50 and has a pointed shape so as to resemblean arrow. More particularly, the eyepoint feature 90 comprises a firstedge 92 that diagonally extends from the lateral edge 66 of the mountingregion 60. Furthermore, the eyepoint feature 90 comprises a second edge94 that extends from the first edge 92 at a sharp point 96 toward thelateral edge 66 of the mounting region 60 in a diagonal manner. Thus,since the eyepoint feature 94 extends outwardly from the mounting region60 of the die paddle 50, an observer's view of the eyepoint feature 90is not obscured by the semiconductor die 32 mounted adjacent themounting region 60 of the die paddle 50.

Thus, it will be appreciated that the eyepoint feature 90 allows anobserver or an automated wire bonding system to quickly determine theorientation of the lead frame 42 within a wire bonding system. Inparticular, when the lead frame 42 is aligned in a preferred orientationin the wire bonding system, the eyepoint feature 90 extends from thelead frame 42 in a first direction. Thus, if the lead frame 42 isrotated about an axis that is perpendicular to the plane of the leadframe 42, eyepoint feature 90 will extend in a second direction which isdifferent from the first direction.

For example, lead frames are sometimes improperly positioned within awire bonding system such that the lead frame is rotated by 180 degreesfrom the preferred orientation. Since lead frames usually have asymmetrical shape, it can be difficult for an observer to detect thismisalignment. However, by forming the die paddle 50 of the lead frame 42with the asymmetrically extending eyepoint feature 90, the observer canreadily detect the misalignment by observing the eyepoint feature 90extending in a direction that is opposed to the preferred direction.

As shown in FIG. 3, the first ends 56 of the lead fingers 44 of the leadframe 42 are disposed adjacent the die paddle 50 in a generally circularpattern. Furthermore, as will be described in greater detail below inconnection with FIG. 4, the first ends 56 have surfaces that provide thelead frame with a second plurality of bonding pads 102 forinterconnecting the lead fingers 44 to the die 32.

Reference will now be made to FIG. 4 which illustrates the semiconductordie 32 mounted to the lead frame 42 and the lead frame 42 andsemiconductor die 32 electrically interconnected in a wire-bondedconfiguration. In particular, the die 32 is fixedly mounted adjacent themounting surface 78 of the mounting region 60 of the die paddle 50 ofthe lead frame 42 in a manner known in the art such that the die 32 ispositioned between the edges 62, 64, 66 and 68 of the mounting region60. Thus, the eyepoint features 54 and 90 of the die paddle 50 extendbeyond the die 32 so that an unobstructed view of the eyepoint features54 and 90 is provided. Consequently, as will be described in greaterdetail below in connection with FIGS. 5 and 6, the wire bonding system110 is able to obtain an image of the lead frame 42 that includes theeyepoint features 54, 90.

As shown in FIG. 4, in the wire-bonded configuration, a plurality ofwire bonds 100, or connecting wires, extend between the lead fingers 44of the lead frame 48 and the semiconductor die 32 in a generally radialmanner so as to electrically couple the lead fingers 44 to the circuitnodes of the die 32. In particular, the connecting wires 100 extend fromthe first plurality of bonding pads 36 disposed on the first surface 34of the die 32 to the second plurality of bonding pads 102 disposed onthe first ends 56 of the lead fingers 44. Specifically, a first end 104of each wire 100 is bonded to the corresponding first bonding pad 36 ofthe die 32. Furthermore, a second end 106 of each wire 100 is bonded tothe second bonding pad 102 on the first end 56 of the corresponding leadfinger 44.

Reference will now be made to FIG. 5 which schematically illustrates oneembodiment of the automated wire bonding system 110 in accordance withone aspect of the present invention. The wire bonding system 110 iscomprised of any of a number of currently available wire bonding systemssuch as Model 2920 Turbo 8028 wire bonding system available from Kulicke& Soffa of Willow Grove, Pa. that has been configured to perform thefeature recognition as described in greater detail below. In particularthe wire bonding system 110 is adapted to position the connecting wires100 of FIG. 4 so that they extend between the first and second bondingpads 36 and 102, and respectively bond the ends 104, 106 of theconnecting wires 100 to the first and second bonding pads 36 and 102.Furthermore, to increase the likelihood that the connecting wires 100are bonded to the desired locations, the wire bonding system 110utilizes the eyepoint features 54, 90 of the die paddle 50 as will bedescribed in greater detail below.

As schematically shown in FIG. 5, the wire bonding system 110 generallycomprises a lead frame support table 112 having a supporting surface114, and an imaging device 116 having an input face for collectinglight. In particular, the imaging device 116 is positioned adjacent thetable 112 so that a portion of light reflecting off of the supportingsurface 114 is directed toward the input face 118 of the imaging device116. Furthermore, the imaging device 116 receives such light through theinput face and focuses the light so as to form an image. In oneembodiment, the imaging device 116 comprises a digital camera thatprovides a digital image.

As shown in FIG. 5, the lead frame 42 is positioned adjacent thesupporting surface 114 of the support table 112. In particular, the leadframe 42 is positioned in a substantially fixed manner so that a portionof light reflecting off of the first surface 38 of the semiconductor die32 enters the input face 118 of the imaging device 116. Furthermore, aportion of light reflecting off of the eyepoint features 54, 90 of thedie paddle 50 and the lead fingers 44 enters the input face 118 of theimaging device. Thus, the image provided by the imaging device 116 issimilar to that which is illustrated in FIG. 4.

As shown in FIG. 5, the wire bonding system 110 further comprises aprocessor 120 having one or more associated memories 122 that controlsthe wire bonding system 110. In particular, the processor 120communicates with the imaging device 116 via a communication path 124such that the processor 120 is able to direct the imaging device 116 toobtain the digital image of the lead frame 42. Furthermore, theprocessor 120 receives the digital image from the imaging device 116 andstores the image in the memory 122 in a known manner. As will bedescribed in greater detail below in connection with FIG. 6, theprocessor 120 utilizes the image stored in the memory 122 to determinethe positions of the first and second bonding pads 36 and 102 withrespect to an origin 126 of the wire bonding system 110 that is fixedlypositioned with respect to the support table 112.

As shown in FIG. 5, the wire bonding system 110 can further comprise auser input device 128 that communicates with the processor 120 via asecond communication path 130 so that a user can enter data and commandsto the processor 120. In particular, in one embodiment, the positions ofthe second bonding pads 102 of the lead frame 42 with respect to theeyepoint features 54, 90 of the lead frame 42 are communicated to theprocessor 120 via the user input device 128 and stored in the memory122. Furthermore, in one embodiment, the positions of the first bondingpads 36 of the semiconductor die 32 with respect to the center of thesemiconductor die 32 are communicated to the processor 120 via the userinput device 128 and stored in the memory 122.

As shown in FIG. 5, the wire bonding system 110 can further comprise awire bonding device 132 which has a movable arm 134 that sequentiallyinstalls the interconnecting wires 100 of FIG. 4. In particular, thewire bonding device 132 communicates with the processor 120 via a thirdcommunication path 136. Furthermore, under the direction of theprocessor 120, the arm 134 of the wire bonding device 132 positions thefirst end 104 of each conducting wire 100 adjacent the correspondingfirst bonding pad 36 of the semiconductor die 32 in a flush manner andmounts the first end 104 of the connecting wire 100 to the first bondingpad 36 in a well known manner. Furthermore, the arm 134 of the wirebonding device 132 extends the connecting wire 110 so that the secondend 106 of the connecting wire 100 is positioned adjacent thecorresponding second bonding pad 102 of the lead frame 42 in a flushmanner. Moreover, the wire bonding device 132 bonds the second end 106of the connecting wire 100 to the second bonding pad 102 in a well knownmanner.

Although the wire bonding device 132 of the wire bonding system 110described above begins at the bonding pads 36 of the semiconductor die32 and ends at the bonding pads 102 of the lead frame 42, it should beapparent to a person skilled in the art that the wire bonding device 132could operate in an alternative manner. Furthermore, the terms first andsecond are provided for illustrative purposes only and are not meant toimply a particular order in which the ends 104, 106 of the connectingwires 100 are installed by the wire bonding system 110. For example, inanother embodiment, the wire bonding device 132 could be adapted toconnect the second end 106 of each wire 100 to the corresponding secondbonding pad 102 of the lead frame 42 before connecting the first end 104of the same wire 100 to the corresponding first bonding pad 36 of thesemiconductor die 32.

As shown in FIG. 5, in one embodiment, the wire bonding system 110 canfurther comprise a lead frame delivery device 138. In particular, thelead frame delivery device 138 communicates with the processor 120 via afourth communication path 140. Furthermore, under the direction of theprocessor 120, the delivery device 138 receives the lead frame 42 havingthe semiconductor die 32 mounted thereto in a non-wire bondedconfiguration from a prior processing station 142 along a first path 144and delivers the lead frame to the support table 112 along a second path146. Moreover, the lead frame delivery device 138 delivers the leadframe 42 in the wire-bonded configuration to a subsequent processingstation 148 along a third path 150.

Reference will now be made to FIG. 6 which is a flow chart 200 thatillustrates the operation of the wire bonding system 110 of FIG. 5. Theflowchart of FIG. 6 is, of course, simply illustrative of the basicoperation of the wire bonding system 110 as the wire bonding system 110determines the location of the second bonding locations using theeyepoint features described above. It should be appreciated that theexact programming steps to implement the process of the presentinvention will vary depending upon the implementation of the invention.

In particular, from a start state 200, the processor 120 enters aninitialization state 202, wherein the processor 120 receives wirebonding data from a user. More particularly, the positions of the firstbonding pads 36 with respect to the die 32, the configuration of theeyepoint features 54, 90 of the die paddle 50 of the lead frame 42, andthe positions of the second bonding pads 102 with respect to theeyepoint features 54, 90 are communicated to the processor 120 via theuser input device 128 and stored in the memory 122. Furthermore, theorientation of the imaging device 116 with respect to the support table112 is communicated to the processor 120 so that the processor 120 candetermine the position of the origin 126 of the wire bonding system 110within the image.

As shown in FIG. 6, the processor 120 then, in a request state 204,requests delivery of the non-wire bonded lead frame 42 from the leadframe delivery device 138. As a result, the delivery device 138positions the non-wire bonded lead frame 42 on the support table 112 ina secure manner.

As shown in FIG. 6, the processor 120, in a request state 206, thenrequests the imaging device 116 to provide the digitized image of thelead frame 42 and semiconductor die 32 to the processor 120. Inparticular, the imaging device 116 receives light coming from the leadframe 42 and semiconductor die 32 and focuses the light to form a realimage. The real image is then processed by the imaging device 116 in awell known manner so as to provide the digitized image. The processor120 then receives the digitized image from the imaging device 116 andstores the digitized image in the memory 122.

As shown in FIG. 6, the processor 120, in a processing state 208, thenanalyzes the digitized image stored in the memory 122 so as to determinethe positions of the first bonding pads 36 of the die 32 with respect tothe origin 126 of the wire bonding system 110. In particular, theprocessor 120 utilizes a known pattern recognition algorithm adapted todetermine the location and orientation of the die 32 with respect to theorigin 126 of the wire bonding system 110. Furthermore, using thelocation and orientation of the die 32 along with the positions of thefirst bonding pads 36 with respect to the die 32, the processor 120computes a first plurality of positions that are the positions of thefirst bonding pads 36 with respect to the origin 126 of the wire bondingsystem 110 and stores the computed first plurality of positions in thememory 122.

The processor 120, in the processing state 208, then further analyzesthe digitized image stored in the memory 122 so as to determine thepositions of the second bonding pads 102 of the lead frame 42 withrespect to the origin 126 of the wire bonding system 110. In particular,using the configuration data of the eyepoint features 54, 90 of the diepaddle 50 stored in the memory 122 during the initialization state 202,the processor 120 scans the image stored in the memory 122 so as toidentify the eyepoint features 54, 90 within the image. The processor120 then determines the average of the positions of the eyepointfeatures 54, 90 with respect to the origin 126 of the wire bondingsystem 110. The processor 120 also determines the orientation of theeyepoint features 54, 90 with respect to the orientation of the image.Preferably, the processor 120 utilizes a known edge detection algorithmthat identifies the edges of the eyepoint features 54, 90 within thedigitized image stored in the memory. Furthermore, using the averageposition and the orientation of the eyepoint features 54, 90 and thepositions of the second bonding pads 102 of the lead frame 42 withrespect to the eyepoint features 54, 90 entered during theinitialization stage 202, the processor 120 computes a second pluralityof positions that are the positions of the second bonding pads 102 ofthe lead frame 42 with respect to the origin 126 and stores the secondplurality of positions in the memory 122.

For example, in one embodiment, the processor 120 in the processingstate 208 attempts to identify the two eyepoint features 54 a and 54 cof FIG. 3. As mentioned previously, each of the eyepoint features 54includes the sharp point 84. While scanning the image, the processor 120identifies the two eyepoint features 54 a and 54 c by identifying theedges 80, 82, and 86 and the sharp point 84. The processor 120 thenequates the positions of the eyepoint features with the positions of thesharp points 84 of the eyepoint features 54 a and 54 c with respect tothe origin 126 of the wire bonding system 110. Furthermore, theprocessor 120 equates the average position of the two eyepoint features54 a and 54 c with respect to the origin 126 with the average of thecomputed positions of the eyepoint features 54 a and 54 c. The processor120 then equates the orientation of the eyepoint features 54 a, 54 cwith the orientation of a vector that points from the sharp point 84 ofthe eyepoint feature 54 c to the sharp point 84 of the eyepoint feature54 a. The processor 120 then computes the second plurality of positionsusing the computed orientation of the eyepoint features 54 a, 54 c, thecomputed average position of the eyepoint features 54 a, 54 c withrespect to the origin 126, and the positions of the second bonding pads102 with respect to the average position of the eyepoint features 54 a,54 c stored in the memory during the initialization stage 202.

However, in another embodiment, it will be appreciated that theprocessor 120 could be adapted to identify the eyepoint features 54, 90in a different configuration. For example, the processor 120 could beadapted to identify the single eyepoint feature 90. In particular, theaverage position of the eyepoint feature 90 could be equated with theposition of the sharp point 96 of the eyepoint feature 90 with respectto the origin 126 of the wire bonding system 110. Furthermore, theorientation of the eyepoint feature 90 could be equated with theorientation of the first edge 92 of the eyepoint feature.

As shown in FIG. 6, the processor, in a request state 210, then requeststhe wire bonding device 132 to form the connecting wires 100 between thefirst and second bonding pads 36, 102. In particular, the processor 120directs the wire bonding device 132 to install each of the connectingwires 100 in a sequential manner. Furthermore, the processor 120instructs the wire bonding device 132 to install the connecting wires100 between the first plurality of positions stored in the memory 122and the second plurality of positions stored in the memory 122 duringthe processing stage 208.

As shown in FIG. 6, the processor, in a state 212, then requests thedelivery device 138 to remove the wire bonded lead frame 42 from thesupport table 112. The delivery device 138 then removes the wire bondedlead frame 42 from the support table 112 and delivers the wire bondedlead frame 42 to the subsequent processing station 148. Furthermore, theprocessor 120 reenters the request state 204 so as to repeat theforegoing wire bonding process on a subsequent lead frame.

Thus, it will be appreciated that the wire bonding system 110 of FIG. 5provides many advantages over prior art wire bonding systems. Inparticular, instead of identifying the relatively small substantiallysimilar first ends 56 of the lead fingers 44 to determine the positionsof the second bonding pads 102 of the lead frame 42 with respect to theorigin 126 as is typically done in prior art wire bonding systems, thewire bonding system 110 instead utilizes the eyepoints features 54, 90extending from the die paddle 50 to determine the positions of thesecond bonding pads 102. Since the eyepoint features 54, 90 arerelatively large, space relatively far apart, and asymmetrically formed,the wire bonding system 110 is able to reliably identify the eyepointfeatures 54, 90 and, thus, determine the positions of the secondplurality of bonding pads 102 with respect to the origin 126 of the wirebonding system 110 with a higher degree of confidence.

As discussed above, the relative position of the second bonding pads 102on the lead fingers to the eyepoint features 54, 90 is previouslyprovided to the wire bonding system. Hence, once the exact location ofthe eyepoint features 54, 90 for a particular lead frame 42 isdetermined by the wire bonding system, the positions of the secondbonding pads 102 on each of the lead fingers can then be determined.Consequently, the wire bonding system 110 is able to install theconnecting wires 100 between the first and second plurality of bondingpads 36, 102 with a greater likelihood of success.

Although the preferred embodiment of the present invention has shown,described and pointed out the fundamental novel features of theinvention as applied to this embodiment, it will be understood thatvarious omissions, substitutions and changes in the form of the detailof the device illustrated may be made by those skilled in the artwithout departing from the spirit of the present invention.Consequently, the scope of the invention should not be limited to theforegoing description, but should be defined by the appending claims.

1. A method of electrically connecting a first plurality of bonding padsof a semiconductor die to a second plurality of bonding pads located onlead fingers of a lead frame of a semiconductor device, the methodcomprising: storing data indicative of (i) the shape and location of atleast one eyepoint features of a lead paddle of an exemplary lead frameadapted to receive a semiconductor die (ii) the relative locationbetween the at least one eyepoint feature of the lead paddle and thefirst plurality of bonding pads of a semiconductor die positioned on theexemplary lead frame and (iii) the relative location of a secondplurality of bonding pads from the at least one eyepoint feature;obtaining an image of a second lead frame corresponding to the exemplarylead frame; identifying the location of at least one eyepoint featureformed on a die paddle of the second lead frame adapted to receive thesemiconductor die wherein the location of at least one eyepoint featureis determined through pattern recognition of the obtained image of thesecond lead frame to recognize an edge of the at least one eyepointimage and then matching the recognized edge of the at least one eyepointimage to the corresponding edge of the eyepoint image of the exemplarylead frame to determine the position of the at least one eyepointfeature; determining the relative locations of the first and secondplurality of bonding pads from the position of the eyepoint featurelocated on the die paddle of the lead frame by using the stored dataindicative of the relative positions between the eyepoint feature of thelead paddle and the first plurality of bonding pads and the secondplurality of bonding pads from the exemplary lead frame; and; directinga wire bonding device to form wire bonds between the first and secondpluralities of bonding pads using the determined relative locations ofthe second plurality of bonding pads.
 2. The method of claim 1, furthercomprising first determining the positions of the second plurality ofbonding pads with respect to the eyepoint features.
 3. The method ofclaim 2, wherein obtaining an image of the lead frame comprises:requesting a digitized image from a digital imaging device; retrievingthe digitized image from the imaging device; and storing the digitizedimage.
 4. The method of claim 3, wherein identifying the location of theat least one eyepoint feature comprises identifying the location of afirst and second eyepoint feature.
 5. The method of claim 3, whereinidentifying the location of the at least one eyepoint feature comprises:using an edge detection algorithm to locate a plurality of edges of theat least one eyepoint feature within the stored digitized image, usingthe located edges to compute the positions of the at least one eyepointfeature with respect to an origin.
 6. The method of claim 5, whereindetermining the relative location of the second plurality of bondingpads from the identified location of the at least one eyepoint featurelocated on the die paddle of the lead frame comprises: using thecomputed position of the at least one eyepoint feature to compute anaverage position of the at least one eyepoint feature with respect tothe origin; using at least one of the located edges of the at least oneeyepoint features to compute an orientation of the at least one eyepointfeature with respect to the orientation of the image; and using thecomputed average position and orientation of the at least one eyepointfeature to compute the positions of the second plurality of bonding padswith respect to the origin.
 7. The method of claim 6, wherein using thecomputed average position and orientation of the at least one eyepointfeature to compute the positions of the second plurality of bonding padswith respect to the origin comprises using the computed average positionand orientation of the at least one eyepoint feature with respect to theorigin in conjunction with the positions of the second plurality ofbonding pads with respect to at least one eyepoint feature.
 8. Themethod of claim 1, wherein directing a wire bonding device to form wirebonds between the first and second pluralities of bonding padscomprises: disposing a first end of at least one wire adjacent acorresponding first bonding pad of the first plurality of bonding pads;bonding the first end of the at least one wire to the correspondingfirst bonding pad; disposing a second end of the at least one wireadjacent a corresponding second bonding pad of the second plurality ofbonding pads; and bonding the second end of the at least on wire to thecorresponding second bonding pad.